India's Semiconductor Gambit: Can Policy Fill a Decades-Old Infrastructure Gap?

India's government has begun drafting a new semiconductor policy aimed at positioning New Delhi as a hub for research and design, a move that reflects both mounting global pressure to diversify supply chains away from East Asia and a long-frustrated national ambition to anchor advanced manufacturing on the subcontinent.
The initiative, disclosed on 20 April 2026, comes after years of policy false starts and at least one collapsed joint venture. Officials familiar with the drafting process told The Indian Express that the new framework will build on the Production Linked Incentive (PLI) scheme for semiconductors while expanding support for design infrastructure, talent pipelines, and research clusters centered on the capital. The intent, according to these accounts, is to move India beyond the chip design capabilities it has quietly built—many of the world's semiconductor firms employ Indian engineers in validation and design roles—toward actual fabrication.
The timing is not accidental. The global semiconductor industry is undergoing its most significant geographic restructuring since the 1990s, driven by US export controls on advanced chips to China, the Taiwan Strait's geopolitical volatility, and Washington and Brussels's explicit push for trusted supply chains. India has been a named beneficiary of this reorientation: the US-India Semiconductor Mission, announced in 2023, committed American diplomatic and technical support to New Delhi's chipmaking push. What the new policy draft attempts is to convert that diplomatic opening into legal and financial architecture.
The Design Edge, the Fabrication Gap
India's position in the semiconductor value chain is lopsided but not negligible. The country has cultivated a substantial pool of chip design talent over two decades; major fabless firms—including those incorporated in the United States—run their validation and design teams out of Bengaluru, Hyderabad, and Noida. This constitutes a genuine comparative advantage. The challenge is that design accounts for a small fraction of semiconductor value added. Fabrication—the actual manufacturing of silicon wafers into working chips—involves capital intensity, precision tooling, and chemical supply chains that are orders of magnitude more complex.
The government's own track record offers cautionary data. In 2023, the International Semiconductor Consortium, a publicly backed joint venture announced with considerable fanfare, failed to secure a technology partner and was effectively dissolved. The collapse exposed a recurring tension in Indian industrial policy: the ability to announce targets and attract interest, and the inability to close deals requiring deep technical collaboration with firms that hold the relevant intellectual property.
Friendshoring and the Diplomatic Overlay
The geopolitical framing of India's semiconductor push has sharpened considerably since 2022. Washington has made clear it views trusted semiconductor partners as a national security interest. The CHIPS Act of 2022 created American subsidies for domestic fabrication, but the Act's implementing rules also extended conditionality around collaboration with China—effectively drawing a line between the US-aligned and Chinese-aligned semiconductor ecosystems. Brussels, through the European Chips Act, has moved in a similar direction.
India sits inside the US-aligned camp by default, a position reinforced by New Delhi's border standoff with China and its deepening QUAD ties. But alignment is not the same as integration. American technology transfer rules remain restrictive; firms like TSMC and Samsung have been cautious about locating advanced fabrication outside their home bases or existing overseas sites in South Korea and the United States. The new Indian policy will need to navigate this constraint—offering enough commercial upside to attract partners while managing the geopolitical optics that make the US side of any deal politically sensitive.
What Comes Next
The policy draft does not yet contain specific financial commitments, and officials have declined to name a timeline for tabling the legislation. The more immediate test will be whether the government can demonstrate concrete progress on infrastructure: the dedicated semiconductor fab parks that the PLI scheme envisioned require serviced land, stable power, and water—utilities where India's track record at scale has been inconsistent.
The broader question is whether the current window will remain open long enough for India to cross the threshold from aspiration to production. Global demand for mature-node chips—less advanced than the cutting edge but essential for automotive, defense, and industrial applications—offers a realistic entry point. India's design talent could be leveraged for Application-Specific Integrated Circuits (ASICs) and compound semiconductor components, niches where the capital bar is lower and the geopolitical sensitivity less acute. Whether New Delhi's policymakers have the institutional patience and sectoral specificity to pursue that narrower path—or will default to the headline-grabbing ambition of a full-scale fab—remains the central uncertainty.
This desk covers industrial policy and technology sovereignty stories from South and Southeast Asia. The Indian Express's reporting on the policy draft led our coverage; we supplemented with historical context on the 2023 consortium collapse and open-source documentation of the PLI scheme's implementation gaps.